High-Performance Polymers and Resins
High-performance polymers and resin materials offer excellent heat resistance, mechanical properties, and chemical stability, making them critical for aerospace and electronics industries.
Product Series
Bismaleimide Resin (BMI)
High-performance thermosetting resin with excellent heat resistance, mechanical strength, and electrical insulation. Widely used in aerospace composites and electronic packaging.
Core Features
- Glass transition temperature Tg ≥250°C
- Heat Deflection Temperature ≥280°C
- Excellent resistance to heat and humidity
Technical Specifications
H-Class Insulation Resin
High-temperature curing resin designed for motor and appliance insulation systems, meeting Class H requirements (180°C), with excellent electrical performance and heat aging resistance.
Core Features
- Insulation Class H (180°C)
- Volume resistivity ≥10^15 Ω·cm
- Dielectric strength ≥20 kV/mm
Technical Specifications
PES (Polyethersulfone)
Amorphous thermoplastic engineering resin with excellent heat resistance, transparency, and dimensional stability. Ideal for medical devices, food processing, and electronics applications.
Core Features
- Operating temperature range 180°C
- High transparency and gloss
- Excellent hydrolytic stability
Technical Specifications
PEK (Polyetherketone)
High-performance semi-crystalline thermoplastic with exceptional heat resistance, mechanical strength, and chemical corrosion resistance. Ideal for aerospace and automotive applications.
Core Features
- Melting point up to 365°C
- Operating temperature range 260°C
- Excellent chemical resistance
Technical Specifications
DDS (4,4'-Diaminodiphenylsulfone)
High-performance epoxy curing agent with excellent heat resistance and mechanical properties, widely used in aerospace composites and electronic packaging materials.
Core Features
- Cured material with a Tg as high as 200°C
- Excellent heat aging resistance
- Good mechanical strength
Technical Specifications
High-toughness epoxy resin
Toughener for resin matrices, coatings, electronic adhesives, and structural adhesives in composite materials.
Core Features
- High thermal stability
- Excellent reactivity
- Good solubility
Technical Specifications
Bismaleimide Resin (BMI)
High-performance thermosetting resin with excellent high-temperature resistance, mechanical strength, and electrical insulation. Widely used in aerospace composites and electronic packaging.
Core Features
Glass transition temperature Tg ≥ 250°C
Heat Deflection Temperature ≥280°C
Excellent moisture and heat resistance
Excellent dielectric performance
Technical Specifications
H-Class Insulation Resin
High-temperature curing resin designed for motor and electrical appliance insulation systems, meeting Class H insulation requirements (180°C), with excellent electrical properties and thermal aging resistance.
Core Features
Insulation Class H (180°C)
Volume resistivity ≥10^15 Ω·cm
Dielectric strength ≥20 kV/mm
Superior corona resistance
Technical Specifications
PES (Polyethersulfone)
Amorphous thermoplastic engineering resin with excellent heat resistance, transparency, and dimensional stability. Ideal for medical devices, food processing, and electronics applications.
Core Features
Operating temperature range: 180°C
High transparency and gloss
Excellent hydrolytic stability
Excellent radiation sterilization tolerance
Technical Specifications
PEK (Polyetherketone)
High-performance semi-crystalline thermoplastic with exceptional heat resistance, mechanical strength, and chemical corrosion resistance. Ideal for aerospace and automotive applications.
Core Features
Melting point up to 365°C
Operating temperature range: 260°C
Excellent chemical resistance
Excellent wear resistance
Technical Specifications
DDS (4,4'-Diaminodiphenylsulfone)
High-performance epoxy curing agent with excellent heat resistance and mechanical properties, widely used in aerospace composites and electronic packaging materials.
Core Features
Cured material with a Tg as high as 200°C
Excellent heat aging resistance
Good mechanical strength
Low Volatile Matter Content
Technical Specifications
High-toughness epoxy resin
Toughening agent for resin matrices, coatings, electronic adhesives, and general-purpose adhesives in composite materials.
Core Features
High thermal stability
Excellent reactivity
Good solubility
Low impurity content
Technical Specifications
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